Flexible Electronic Packaging and Encapsulation Technology

Flexible Electronic Packaging and Encapsulation Technology

149,00 €*

in Vorbereitung

Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology.

1 OVERVIEW OF FLEXIBLE ELECTRONIC ENCAPSULATING TECHNOLOGY<br>1.1 Flexible electronics overview<br>1.2 Development of flexible electronic encapsulating technology<br>1.3 Encapsulating technology of several important flexible electronic devices <br>1.4 Flexible electronic encapsulating materials<br>1.5 Overview of the development of flexible electronic packaging at home and abroad<br> <br>2 BASIC CONCEPTS RELATED TO FLEXIBLE ELECTRONIC PACKAGING<br>2.1 Composition of Flexible Electronic Packaging<br>2.2 Flexible Electronic Packaging Structure<br>2.3 Encapsulation Principle<br>2.4 Packaging Technology<br>2.5 Packaging Stability<br>2.6 Encapsulated Products<br>2.7 Chapter Summary<br> <br>3 FLEXIBLE SUBSTRATES<br>3.1 Concept and connotation of flexible substrates<br>3.2 Development history of flexible substrates<br>3.3 Flexible substrate materials<br>3.4 Molding technology of flexible substrate<br>3.5 Performance evaluation of flexible substrates<br>3.6 Application of flexible substrates<br>3.7 Development trend of flexible substrates<br> <br>4 TEST METHODS<br>4.1 Sealing test<br>4.2 Bending test<br>4.3 Mechanical performance testing<br>4.4 Stability testing<br> <br>5 FLEXIBLE ELECTRONIC ENCAPSULATION<br>5.1 Inorganic encapsulating material<br>5.2 Organic encapsulating material<br>5.3 Organic-inorganic hybrid encapsulating material<br> <br>6 DEVELOPMENT OF FLEXIBLE ELECTRONICS PACKAGING TECHNOLOGY<br>6.1 Flexible Electronics Packaging<br>6.2 Thin Film Packaging Technology<br> <br>7 APPLICATION OF FLEXIBLE ELECTRONICS PACKAGING<br>7.1 Industry chain analysis of flexible electronics packaging<br>7.2 Packaging applications of flexible OLED devices<br>7.3 Packaging applications for flexible solar cells<br>7.4 Packaging applications for flexible electronic devices<br>7.5 Packaging applications for flexible electronics sensors<br> <br>8 TESTING STANDARDS<br>8.1 Terminology and alphabetic symbols<br>8.2 Mechanical test method (deformation test)<br>8.3 Environmental test methods<br>8.4 Mechanical test methods (impact and hardness tests)<br> <br>9 ANALYSIS OF FLEXIBLE ELECTRONIC PACKAGING ENTERPRISE<br>9.1 Flexible Electronic Packaging Enterprise<br>9.2 Analysis of Flexible Electronic Packaging Enterprises<br> <br>10 FLEXIBLE ELECTRONICS PACKAGING DEVELOPMENT TRENDS<br>10.1 Flexible electronics packaging trends overview<br>10.2 Introduction of three packaging technologies for flexible electronic devices<br>10.3 Flexible electronics packaging development trend summary<br> <br><br> <br>
ISBN 9783527353590
Artikelnummer 9783527353590
Medientyp Buch
Auflage 1. Auflage
Copyrightjahr 2024
Verlag Wiley-VCH
Umfang 384 Seiten
Abbildungen 9 Farbabb.
Sprache Englisch