OVERVIEW OF WORKSPHYSICAL BASIS OF THERMAL CONDUCTIONBasic Concepts and Laws of Thermal ConductionHeat Conduction Differential Equation and Finite SolutionHeat Conduction Mechanism and Theoretical CalculationThermal Conductivity of SolidsELECTRONIC PACKAGING MATERIALS FOR THERMAL MANAGEMENTDefinition and Classification of Electronic PackagingThermal Management in Electronic EquipmentRequire of Electronic Packaging MaterialsElectronic Packaging MaterialsCHARACTERIZATION METHODS FOR THERMAL MANAGEMENT MATERIALSOverview of the Development of Thermal Conductivity Test MethodsTest Method Classification and StandardsSteady-State MethodNon-Steady-State MethodElectrical Properties and Measurement TechniquesMaterial Characterization Analysis TechnologyReliability Analysis and Environmental Performance EvaluationCONSTRUCTION OF THERMAL CONDUCTIVITY NETWORK AND PERFORMANCE OPTIMIZATION OF POLYMER SUBSTRATESynthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of SubstratesStudy on Polymer Thermal Conductive Composites with Oriented StructurePreparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton StructureAssembly of Thermal Conductive Materials in Different Dimensions and Preparation of Composite MaterialsConclusionOPTIMAL DESIGN OF HIGH THERMAL CONDUCTIVE METAL SUBSTRATE SYSTEM FOR HIGH POWER DEVICESPower Devices and Thermal ConductionOptimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and ComponentsFormation and Evolution Rules of High Thermal Conductive Interface and its Control MethodFormation and Evolution Rules of High Thermal Conductive Composite Microstructure and its Control MethodPREPARATION AND PERFORMANCE STUDY OF SILICON NITRIDE CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITYRapid Nitridation of Silicon Compact and Tape Casting of SiliconOptimization of Sintering Aids for High Thermal Conductivity Si3N4 CeramicsInvestigation of Cu-Metalized Si3N4 Substrates via Active Metal Brazing (AMB) MethodPREPARATION AND PROPERTIES OF THERMAL INTERFACE MATERIALSConception of Thermal Interface MaterialsPolymer Based Thermal Interface MaterialsMetal Based Thermal Interface MaterialsCarbon Based Thermal Interface MaterialsMolecular Simulation Study of Interfacial Thermal TransferSTUDY ON SIMULATION OF THERMAL CONDUCTIVE COMPOSITE FILLING THEORYMolecular Simulation Algorithms for Thermal Conductivity CalculatingMolecular Simulation Study on PolymersMolecular Simulation Study on TC of Si3N4 CeramicsMolecular Simulation Study on TC of Diamond/Copper CompositesSimulation Study on Polymer-Based CompositesMARKET AND FUTURE PROSPECTS OF HIGH THERMAL CONDUCTIVITY COMPOSITE MATERIALSBasic Concept of Composite MaterialsThermal Conductivity Mechanism and Thermal Conductivity ModelComposite Materials in Electronic DevicesThermal Functional CompositesThe Modification of Composite MaterialsThe New Packaging MaterialThermal Management of Electronic DevicesMethods for Improving Thermal Conductivity of Composite MaterialsThe Application of Composite MaterialsConclusions