OVERVIEW OF WORKS<br> <br>PHYSICAL BASIS OF THERMAL CONDUCTION<br>Basic Concepts and Laws of Thermal Conduction<br>Heat Conduction Differential Equation and Finite Solution<br>Heat Conduction Mechanism and Theoretical Calculation<br>Thermal Conductivity of Solids<br> <br>ELECTRONIC PACKAGING MATERIALS FOR THERMAL MANAGEMENT<br>Definition and Classification of Electronic Packaging<br>Thermal Management in Electronic Equipment<br>Require of Electronic Packaging Materials<br>Electronic Packaging Materials<br> <br>CHARACTERIZATION METHODS FOR THERMAL MANAGEMENT MATERIALS<br>Overview of the Development of Thermal Conductivity Test Methods<br>Test Method Classification and Standards<br>Steady-State Method<br>Non-Steady-State Method<br>Electrical Properties and Measurement Techniques<br>Material Characterization Analysis Technology<br>Reliability Analysis and Environmental Performance Evaluation<br> <br>CONSTRUCTION OF THERMAL CONDUCTIVITY NETWORK AND PERFORMANCE OPTIMIZATION OF POLYMER SUBSTRATE<br>Synthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of Substrates<br>Study on Polymer Thermal Conductive Composites with Oriented Structure<br>Preparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton Structure<br>Assembly of Thermal Conductive Materials in Different Dimensions and Preparation of Composite Materials<br>Conclusion<br> <br>OPTIMAL DESIGN OF HIGH THERMAL CONDUCTIVE METAL SUBSTRATE SYSTEM FOR HIGH POWER DEVICES<br>Power Devices and Thermal Conduction<br>Optimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and Components<br>Formation and Evolution Rules of High Thermal Conductive Interface and its Control Method<br>Formation and Evolution Rules of High Thermal Conductive Composite Microstructure and its Control Method<br> <br>PREPARATION AND PERFORMANCE STUDY OF SILICON NITRIDE CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY<br>Rapid Nitridation of Silicon Compact and Tape Casting of Silicon<br>Optimization of Sintering Aids for High Thermal Conductivity Si3N4 Ceramics<br>Investigation of Cu-Metalized Si3N4 Substrates via Active Metal Brazing (AMB) Method<br> <br>PREPARATION AND PROPERTIES OF THERMAL INTERFACE MATERIALS<br>Conception of Thermal Interface Materials<br>Polymer Based Thermal Interface Materials<br>Metal Based Thermal Interface Materials<br>Carbon Based Thermal Interface Materials<br>Molecular Simulation Study of Interfacial Thermal Transfer<br> <br>STUDY ON SIMULATION OF THERMAL CONDUCTIVE COMPOSITE FILLING THEORY<br>Molecular Simulation Algorithms for Thermal Conductivity Calculating<br>Molecular Simulation Study on Polymers<br>Molecular Simulation Study on TC of Si3N4 Ceramics<br>Molecular Simulation Study on TC of Diamond/Copper Composites<br>Simulation Study on Polymer-Based Composites<br> <br>MARKET AND FUTURE PROSPECTS OF HIGH THERMAL CONDUCTIVITY COMPOSITE MATERIALS<br>Basic Concept of Composite Materials<br>Thermal Conductivity Mechanism and Thermal Conductivity Model<br>Composite Materials in Electronic Devices<br>Thermal Functional Composites<br>The Modification of Composite Materials<br>The New Packaging Material<br>Thermal Management of Electronic Devices<br>Methods for Improving Thermal Conductivity of Composite Materials<br>The Application of Composite Materials<br>Conclusions<br> <br>